Google Teams Up with TSMC for Production of Tensor G5 Chipset Powering Upcoming Pixel 10
Google’s ambitious strides in the smartphone chipset arena are taking a significant leap with the development of the Tensor G5, which is poised to be a cornerstone for the upcoming Pixel 10 series, slated for release in 2025. Recent data from a publicly accessible trade database has confirmed a partnership between Google and TSMC (Taiwan Semiconductor Manufacturing Company), marking a departure from Samsung, which previously fabricated Google’s chipsets.
This partnership comes to light through detailed shipping manifests that list the exchange of goods related to the Tensor G5’s early production stages. Although the manifest does not explicitly mention “Tensor G5,” clues within the document refer to “LGA,” which insiders recognize as a codename linked to Google’s chipset, specifically “Laguna Beach.”
The document lists a chip revision “A0,” indicating an initial sample likely undergoing preliminary tests. This early version, tagged with “NPI-OPEN” and undergoing a “system-level test” (SLT), hints at rigorous evaluation processes to refine the chipset. Further intriguing is the mention of 16GB of RAM associated with the chipset, suggesting Google’s intent to boost memory capabilities in its next-generation Pixel phones significantly.
The importer named in the documentation, Tessolve Semiconductor, is based in India and specializes in semiconductor testing and verification. This demonstrates Google’s strategic use of global resources for cost-effective and efficient development processes.
As the Tensor G5 takes shape, it embodies Google’s commitment to integrating cutting-edge technology into its devices. The shift to TSMC as the fabricator not only underscores a change in strategy but also promises enhancements in chip performance and efficiency, potentially setting new benchmarks for the Pixel lineup.
